Beranda6146 • TYO
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Disco Corp
Tutup sebelumnya
¥40.100,00
Rentang tahun
¥22.640,00 - ¥53.680,00
Kapitalisasi pasar
4,35 T JPY
Volume Rata-Rata
5,46 jt
Rasio P/E
35,16
Hasil dividen
1,03%
Bursa utama
TYO
Dalam berita
Keuangan
Laporan Pendapatan
Pendapatan
Laba bersih
| (JPY) | Jun 2025info | Perubahan Y/Y |
|---|---|---|
Pendapatan | 89,91 M | 8,59% |
Biaya operasional | 27,02 M | 11,06% |
Laba bersih | 23,77 M | 0,23% |
Margin laba bersih | 26,43 | -7,72% |
Penghasilan per saham | — | — |
EBITDA | 34,48 M | -4,55% |
Tarif pajak efektif | 29,36% | — |
Neraca
Total aset
Total liabilitas
| (JPY) | Jun 2025info | Perubahan Y/Y |
|---|---|---|
Investasi tunai jangka pdk | 198,50 M | -9,08% |
Total aset | 620,08 M | 10,94% |
Total liabilitas | 135,16 M | -10,94% |
Total ekuitas | 484,92 M | — |
Saham yang beredar | 108,42 jt | — |
Harga terhadap nilai buku | 8,97 | — |
Tingkat pengembalian aset | — | — |
Tingkat pengembalian modal | — | — |
Arus Kas
Perubahan kas bersih
| (JPY) | Jun 2025info | Perubahan Y/Y |
|---|---|---|
Laba bersih | 23,77 M | 0,23% |
Kas dari operasi | — | — |
Kas dari investasi | — | — |
Kas dari pembiayaan | — | — |
Perubahan kas bersih | — | — |
Arus kas bebas | — | — |
Tentang
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Didirikan
5 Mei 1937
Situs
Karyawan
5.256
