MwanzoDISPF • OTCMKTS
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Disco Corp
Bei iliyotangulia
$ 303.60
Bei za siku
$ 277.01 - $ 277.01
Bei za mwaka
$ 181.00 - $ 336.00
Thamani ya kampuni katika soko
4.40T JPY
Wastani wa hisa zilizouzwa
25.00
Uwiano wa bei na mapato
-
Mgao wa faida
-
Ubadilishanaji wa msingi
TYO
Habari za soko
Fedha
Taarifa ya Mapato
Mapato
Mapato halisi
| (JPY) | Jun 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Mapato | 89.91B | 8.59% |
Matumizi ya uendeshaji wa biashara | 27.02B | 11.06% |
Mapato halisi | 23.77B | 0.23% |
Kiwango cha faida halisi | 26.43 | -7.72% |
Mapato kwa kila hisa | — | — |
EBITDA | 34.48B | -4.55% |
Asilimia ya kodi ya mapato | 29.36% | — |
Taarifa ya Hali ya Kifedha
Jumla ya mali
Jumla ya dhima
| (JPY) | Jun 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Uwekezaji wa pesa taslimu na vipindi vifupi | 198.50B | -9.08% |
Jumla ya mali | 620.08B | 10.94% |
Jumla ya dhima | 135.16B | -10.94% |
Jumla ya hisa | 484.92B | — |
hisa zilizosalia | 108.42M | — |
Uwiano wa bei na thamani | 0.07 | — |
Faida inayotokana na mali | — | — |
Faida inayotokana mtaji | — | — |
Mtiririko wa pesa
Mabadiliko halisi ya pesa taslimu
| (JPY) | Jun 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Mapato halisi | 23.77B | 0.23% |
Pesa kutokana na shughuli | — | — |
Pesa kutokana na uwekezaji | — | — |
Pesa kutokana na ufadhili | — | — |
Mabadiliko halisi ya pesa taslimu | — | — |
Mtiririko huru wa pesa | — | — |
Kuhusu
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Afisa Mkuu Mtendaji (CEO)
Ilianzishwa
5 Mei 1937
Tovuti
Wafanyakazi
5,256
