HomeDSCSY • OTCMKTS
add
Disco ADR
Previous close
$28.91
Day range
$29.52 - $30.24
Year range
$23.09 - $42.93
Market cap
4.97T JPY
Avg Volume
184.45K
Market news
Financials
Income Statement
Revenue
Net income
| (JPY) | Dec 2024info | Y/Y change |
|---|---|---|
Revenue | 93.55B | 21.51% |
Operating expense | 27.49B | 23.21% |
Net income | 31.81B | 97.92% |
Net profit margin | 34.00 | 62.91% |
Earnings per share | — | — |
EBITDA | 41.89B | 27.19% |
Effective tax rate | 23.94% | — |
Balance Sheet
Total assets
Total liabilities
| (JPY) | Dec 2024info | Y/Y change |
|---|---|---|
Cash and short-term investments | 263.49B | 52.99% |
Total assets | 628.79B | 26.75% |
Total liabilities | 174.69B | 38.17% |
Total equity | 454.09B | — |
Shares outstanding | 108.37M | — |
Price to book | 0.01 | — |
Return on assets | 16.04% | — |
Return on capital | 21.97% | — |
Cash Flow
Net change in cash
| (JPY) | Dec 2024info | Y/Y change |
|---|---|---|
Net income | 31.81B | 97.92% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. Wikipedia
Founded
May 5, 1937
Website
Employees
4,886
