BerandaDSCSY • OTCMKTS
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Disco ADR
Tutup sebelumnya
$20,10
Rentang hari
$19,68 - $20,10
Rentang tahun
$16,10 - $42,93
Kapitalisasi pasar
3,08Â T JPY
Volume Rata-Rata
229,31Â rb
Dalam berita
Keuangan
Laporan Pendapatan
Pendapatan
Laba bersih
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Pendapatan | 120,72Â M | 15,74% |
Biaya operasional | 32,57Â M | 29,21% |
Laba bersih | 38,64Â M | 9,07% |
Margin laba bersih | 32,01 | -5,74% |
Penghasilan per saham | — | — |
EBITDA | 54,70Â M | 11,91% |
Tarif pajak efektif | 24,89% | — |
Neraca
Total aset
Total liabilitas
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Investasi tunai jangka pdk | 229,17Â M | 6,35% |
Total aset | 654,09Â M | 17,63% |
Total liabilitas | 161,39Â M | 7,95% |
Total ekuitas | 492,70 M | — |
Saham yang beredar | 108,40 jt | — |
Harga terhadap nilai buku | 0,00 | — |
Tingkat pengembalian aset | 20,13% | — |
Tingkat pengembalian modal | 27,28% | — |
Arus Kas
Perubahan kas bersih
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Laba bersih | 38,64Â M | 9,07% |
Kas dari operasi | — | — |
Kas dari investasi | — | — |
Kas dari pembiayaan | — | — |
Perubahan kas bersih | — | — |
Arus kas bebas | — | — |
Tentang
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Didirikan
5 Mei 1937
Situs
Karyawan
4.886
