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Disco ADR
Tutup sebelumnya
$27.59
Julat hari
$26.74 - $27.01
Julat tahun
$19.98 - $42.93
Permodalan pasaran
4.54T JPY
Bilangan Purata
339.75K
Berita pasaran
Kewangan
Penyata Pendapatan
Hasil
Pendapatan bersih
| (JPY) | Sep 2024info | Perubahan T/T |
|---|---|---|
Hasil | 96.24B | 33.12% |
Perbelanjaan pengendalian | 26.46B | 23.36% |
Pendapatan bersih | 29.73B | 48.46% |
Margin untung bersih | 30.89 | 11.52% |
Pendapatan bagi setiap syer | — | — |
EBITDA | 45.41B | 48.25% |
Kadar cukai berkesan | 27.93% | — |
Kunci Kira-kira
Jumlah aset
Jumlah liabiliti
| (JPY) | Sep 2024info | Perubahan T/T |
|---|---|---|
Pelaburan tunai dan jangka pendek | 243.57B | 38.51% |
Jumlah aset | 591.00B | 20.19% |
Jumlah liabiliti | 154.47B | 17.50% |
Jumlah ekuiti | 436.53B | — |
Syer tertunggak | 108.37J | — |
Harga kepada buku | 0.01 | — |
Pulangan pada aset | 18.51% | — |
Pulangan pada modal | 25.23% | — |
Aliran Tunai
Perubahan bersih dalam tunai
| (JPY) | Sep 2024info | Perubahan T/T |
|---|---|---|
Pendapatan bersih | 29.73B | 48.46% |
Tunai daripada operasi | — | — |
Tunai daripada pelaburan | — | — |
Tunai daripada pembiayaan | — | — |
Perubahan bersih dalam tunai | — | — |
Aliran tunai bebas | — | — |
Perihal
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. Wikipedia
Diasaskan
5 Mei 1937
Tapak web
Pekerja
4,886
