MwanzoDSCSY • OTCMKTS
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Disco ADR
Bei iliyotangulia
$ 24.24
Bei za siku
$ 25.62 - $ 25.81
Bei za mwaka
$ 16.66 - $ 42.93
Thamani ya kampuni katika soko
4.15T JPY
Wastani wa hisa zilizouzwa
elfu 116.67
Habari za soko
Fedha
Taarifa ya Mapato
Mapato
Mapato halisi
(JPY) | Jun 2024info | Mabadiliko Tangu Mwaka Uliopita |
---|---|---|
Mapato | 82.80B | 53.44% |
Matumizi ya uendeshaji wa biashara | 24.33B | 33.57% |
Mapato halisi | 23.71B | 86.98% |
Kiwango cha faida halisi | 28.64 | 21.87% |
Mapato kwa kila hisa | — | — |
EBITDA | 36.12B | 84.71% |
Asilimia ya kodi ya mapato | 28.95% | — |
Taarifa ya Hali ya Kifedha
Jumla ya mali
Jumla ya dhima
(JPY) | Jun 2024info | Mabadiliko Tangu Mwaka Uliopita |
---|---|---|
Uwekezaji wa pesa taslimu na vipindi vifupi | 218.33B | 42.51% |
Jumla ya mali | 558.93B | 22.97% |
Jumla ya dhima | 151.77B | 31.62% |
Jumla ya hisa | 407.15B | — |
hisa zilizosalia | 108.36M | — |
Uwiano wa bei na thamani | 0.01 | — |
Faida inayotokana na mali | 14.96% | — |
Faida inayotokana mtaji | 20.50% | — |
Mtiririko wa pesa
Mabadiliko halisi ya pesa taslimu
(JPY) | Jun 2024info | Mabadiliko Tangu Mwaka Uliopita |
---|---|---|
Mapato halisi | 23.71B | 86.98% |
Pesa kutokana na shughuli | — | — |
Pesa kutokana na uwekezaji | — | — |
Pesa kutokana na ufadhili | — | — |
Mabadiliko halisi ya pesa taslimu | — | — |
Mtiririko huru wa pesa | — | — |
Kuhusu
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. Wikipedia
Afisa Mkuu Mtendaji (CEO)
Ilianzishwa
5 Mei 1937
Tovuti
Wafanyakazi
4,886